A7720 Series

5G Smart Internet of Vehicles Solution Platform

The A7720 series is a vehicle-grade 5G cellular communication processor chip independently developed by UNISOC. It has the advantages of high computing power, high performance, low power consumption, high integration, etc. It has passed the certification of the AEC-Q100 vehicle-grade process system. It provides universal high-speed interfaces such as USB3.1 and PCIE3.0, and supports the functional expansion requirements of the new generation of T-BOX products. At the same time, the A7720 series is equipped with a quad-core A55 with up to 20K DMIPS built-in, providing strong processing power for more application scenarios of T-BOX products.

Product Features
A complete new generation of TBOX smart Internet of Vehicles solution

It has a built-in 2/3/4/5G cellular communication module, supporting data transmission and call services. 

The space-air integrated solution: 5G + V2X + IoT NTN 

The open-source OS solution: Yocto 3.1; Linux 5.4 

A built-in HSM security solution 

Ultra-strong expansion and connection capabilities, supporting in-vehicle Gigabit Ethernet networks

Ultra-strong computing power of 5G

CPU:4 * A55 @ 2.0 GHz,20k DMIPS

5G SA&NSA 3GPP R16; TDD+FDD 5G 2CC(130M)

SA: DL 4*4MIMO 3.0 Gbps,UL 2*2MIMO 1.25Gbps;

NSA: DL 3.13Gbps ,UL 836Mbps

4G: LTE Cat.15DL 866Mbps;Cat.18UL 211Mbps

2/3G: WCDMA,GGE

Rich interfaces

USB3.1/2.0、UFS 3.1、PCIE 3.0、I2S*6、UART*9

Vehicle regulation certification, ensuring safety and reliability

It supports the strict vehicle regulation certification of AEC-Q100. 

The supported operating temperature range is: -40°C to 85°C (95°C for eCall).

Product Parameters
CPU
CPU

CPU: 4*A55 @ 2.0 GHz, 20k DMIPS

Memory
RAM

LPDDR4x @ 2133MHz Up to 32 GB

ROM

eMMC 5.1; UFS3.1

Communication (Required)
Standard

5G SA&NSA 3GPP R16:TDD+FDD 5G 2CC (130M)

SA:DL 4*4MIM0 3.0Gbps, UL 2*2MIMO 1.25Gbps;

Capacity

NSA: DL 3.13Gbps, UL 836Mbps

4G: LTE Cat.15DL 866Mbps; Cat.18UL 211Mbps

2/3G:WCDMA, GGE

Interface
Interface

PCle Gen3 1lane*1,Rc,USB3.1/2.0*1,SD10 3.0*2

UART*9,SPI*4,12S*6,12C*4,(U)SIM*2

Technology
Technology

TSMC 6nm EUV