UNISOC's 5G smart cockpit chipset, the A7870, meets all AEC-Q100 automotive testing standards and can handle extreme temperatures from -40℃ to +85℃, making it the perfect solution for the high-reliabily demands of the market.

Using advanced 6nm EUV technology, the process has been shrunk down to a 13.5nm wavelength—close to X-ray precision. This offers an extremely high lithography resolution and a better balance between chipset cost, performance, and power usage.Compared to the previous generation 7nm process, the 6nm technology increases transistor density by 18% while reducing power consumption by 8%, thus creating better performance with a smaller volume.

The product features a full security ecosystem, covering all aspects of hardware and software, and providing multi-layered TEE solutions and cloud integration. Security is guaranteed from the base-layer of the chipset.It supports multiple Hypervisor platforms, including QNX, providing secure and reliable real-time multi-system OS support.

Featuring a top-grade CPU/NPU/GPU, the platform is able to deliver up to 93K DMIPS of computing power, 8 TOPS of calculation power, and 486.4 GFLOPS of graphics processing power. This provides a reliable foundation for customized, intelligent in-vehicle solutions.

The platform comes with a wide range of data and control interfaces, video input/output, and multimedia support, along with multiple communication standards. The system-level chipset optimization and peripheral circuits, combined with UNISOC’s RFFE solutions, significantly improves product development efficiency.

Widely used in key automotive smart terminals such as in-vehicle cockpits, central control systems, T-boxes, smart dashcams, and cockpit communication systems, UNISOC's solutions can be found throughout the world, including China, Europe, Asia-Pacific, Latin America, the Middle East, and Africa, offering tailored solutions for both domestic and international carmakers.