V516

The industry's first 5G R16 Ready chip platform

The Unisoc V516 is the industry's first Internet of Things 5G baseband chip platform that supports 5G R16 Ready. It supports 5G LAN, CAG, and multiple slices of 5G networks. Its reliability reaches 99.99%, and it can achieve air interface latency at the millisecond level and 5G network timing with an accuracy of 1 microsecond. For vertical industries, the V516 can effectively lower the threshold for the industrial application of 5G R16 technology, lead 5G to further empower thousands of industries, give birth to new digital ecosystems, and drive multiple industry sectors to set sail and sail far on the wave of 5G R16.

Product Features
Features of 5G R16 for vertical industries

Support the R16 features required by industries: 5G LAN, URLLC, air interface latency at the millisecond level, etc.

A single chip supports full network access.

Support TDD NR/FDD NR/FDD-LTE/TDD-LTE/TD-SCDMA/WCDMA/GSM.

Support Sub-6GHz, which is the mainstream 5G frequency band globally.

Support the 5G frequency bands of Chinese operators, such as n78/n41/n79/n1/n28/n8, etc.

Also support frequency bands like n77/n3/n20 of overseas operators.

Support the ENDC combination of LTE 3CC + NR 1CC, which is widely compatible with overseas 5G NSA networks.

Meet the working environment of the industrial Internet and can be adapted to various industry terminals.

Rich interfaces: Support PCIE, USB 3.0, SDIO 3.0, UART, SPI, I2S, I2C and GPIO.

Support extended operating temperature: ranging from -40 to 85 degrees Celsius.

Support 5G dual-mode.

Automatically adapt to the 5G NSA and SA dual-mode networks without the need for users to configure manually.

Mature dual-A55 OPENCPU architecture.

Support the OPENCPU architecture, eliminating the need for third-party MCU/MPU chips.

The DDR has more than 60MB of resources, meeting the memory requirements for third-party application development.

Open solutions

Flexibly match with RFFE.

Flexibly match with the host computer.

Product Parameters
Processor
CPU

Dual-core

Max CPU Frequency

1.35GHz

Core

Dual

Process

12nm

Interface
USB

USB3.0

PCIE

PCIE Gen2.0

SDIO

SDIO 3.0

Memory
Memory Type

LPDDR4/X

Max DDR Frequency

1866MHz

Communication
Cellular

3GPP Rel.16

TDD NR/FDD NR/FDD-LTE/TDD-LTE/

TD-SCDMA/WCDMA/GSM/GPRS/EDGE

5G NR

Sub-6GHz

DL 2Gbps/UL 1Gbps

NSA & SA

HPUE

LTE-A

Cat12 DL, Cat13 UL, 3CC DL, 2CC UL,

600Mbps DL, 150Mbps UL